BGA COAT Reballing and Reflow

The BGA COAT creates an interface between the BGA and the PCB. The accessory is strongly attached to the PCB and mechanical failure probabilities (such as after a fall) almost eliminated. It also creates a coating around the solder balls of the BGA component. The solder balls protected from environmental influences such as humidity and oxidation, and the joint probabilities of failure by fracture is limited. Also the phenomenon of the increase in tin whisker is limited and the flow of solder from one joint to another. The BGA COAT has good thermal conductivity (higher than most thermal pad and thermal pastes). This results in the equalization of the temperature at the base of the BGA component by eliminating the chances of a problem because of partial overheating of the component. It can also create a direct link between the base of the BGA component and heat sink cooling system In this way, the temperature at the base of BGA reduced. During curing absorbs all the moisture that could be located beneath the BGA component and around the balls welds. In this way the welding spheres are coated in a dry, well protected environment. It can be applied easily using only a spatula supplied in the box. The package includes everything needed for repairs to 100 (package contains enough material to produce about 70 ml BGA COAT). Most BGA type components require placing 0.5 ml BGA COAT, and can hold the form and size for temperatures up to 250 degrees (Celsius).