CS-FLUX Reballing και Reflow 15g
CS-FLUX Reballing και Reflow 15g
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€29.00
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Pick up from the Woodmart Store
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Free
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Courier delivery
Our courier will deliver to the specified address
2-3 Days
Free
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DHL Courier delivery
DHL courier will deliver to the specified address
1-3 Days
Free
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Warranty 1 year
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Free 30-Day returns
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Description
CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected.
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